TodayToday's edition
62 specs listed, 29 of them differ. Each value is the maker's own; nothing is converted or scored.
| Field | Supermicro Supermicro AS -1115HS-TNR | Supermicro Supermicro AS -1125HS-TNR |
|---|---|---|
| Part number | AS -1115HS-TNR | AS -1125HS-TNR |
| Specs, as each maker lists them | ||
| CPU | Single processor(s); AMD EPYC™ 9004/9005 Series Processors, (* AMD EPYC™ 9005 Series drop-in support requires board revision 2.x) | Dual processor(s); AMD EPYC™ 9004/9005 Series Processors, (* AMD EPYC™ 9005 Series drop-in support requires board revision 2.x) |
| Memory | Slot Count: 24 DIMM slots, Max Memory (1DPC): Up to 3TB 4800MT/s ECC DDR5 RDIMM (AMD EPYC™ 9004 Series Processor), Max Memory (2DPC): Up to 6TB 4000MT/s ECC DDR | Slot Count: 24 DIMM slots; Max Memory (1DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM (AMD EPYC™ 9004 Series Processor, MB R1.x/R2.0/R2.01); Max Memory (1DPC): Up to |
| Core Count | Up to 192C/320T | Up to 320C/640T |
| Motherboard | Super H13SSH | Super H13DSH |
| Max GPU Count | Up to 1 double-width or 2 single-width GPUs | Not listed |
| Supported GPU | NVIDIA PCIe: H100, L4, L40S, RTX 4000 Ada Generation | Not listed |
| Processor Note | Supports up to 500W TDP CPUs *, *Air Cooled CPUs with TDP over 360W only supported under specific conditions. Contact a Supermicro representative for details. | Supports up to 400W TDP CPUs *, *Air Cooled CPUs with TDP over 290W only supported under specific conditions. Contact a Supermicro representative for details. |
| Operating Systems | Genoa: ESXi 7.0 U3, ESXi 8.0, Oracle Linux 9.0, RHEL 9.0, Windows Server 2022, Windows Server 2025; Turin: Windows Server 2022, Windows Server 2025 | Genoa: ESXi 7.0 U3, ESXi 8.0, Hypervisor 8.2.1, Oracle Linux 9.0, RHEL 8.8, RHEL 9.0, SLES 15 SP4, SLES 15 SP5, Windows Server 2022, Windows Server 2025 |
| CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect | Not listed |
| Enterprise Solutions | VMWare vSAN | VMWare vSAN, Microsoft Azure Local |
| GPU-GPU Interconnect | PCIe | Not listed |
| Optional Power Supply 1 | 2x 1300W Redundant (1 + 1) Gold (Certification Pending) Level power supplies | Not listed |
| Optional Power Supply 2 | 2x 1600W Redundant (1 + 1) Titanium Level (96%) power supplies | Not listed |
| Optional Power Supply 3 | 2x 2000W Redundant (1 + 1) power supplies | Not listed |
| Drive Bays / Storage - M.2 | 1 M.2 PCIe 3.0 x4 NVMe slot (M-key 22110(default)/2280), 1 M.2 PCIe 3.0 x2 NVMe slot (M-key 22110(default)/2280) | 2 M.2 PCIe 3.0 x4 NVMe slots (M-key 2280/22110) |
| On-Board Devices - Chipset | AMD System on Chip | Not listed |
| System Cooling - Air Shroud | 1 Air Shroud | 2 Air Shrouds |
| Optional Power Supply 1 - +12V | Max: 108.3A / Min: 0A | Not listed |
| Optional Power Supply 2 - +12V | Max: 83.3A / Min: 0A (100Vac-127Vac), Max: 133.3A / Min: 0A (200Vac-240Vac) | Not listed |
| Optional Power Supply 1 - Input | 1300W: -44--65Vdc / 50-60Hz | Not listed |
| Optional Power Supply 2 - Input | 1000W: 100-127Vac / 50-60Hz, 1600W: 200-240Vac / 50-60Hz, 1600W: 200-240Vdc / 50-60Hz (for CQC only) | Not listed |
| Optional Power Supply 1 - 12V SB | Max: 2.1A | Not listed |
| Optional Power Supply 2 - 12V SB | Max: 3.5A | Not listed |
| Optional Power Supply 1 - Output Type | Backplanes (gold finger) | Not listed |
| Optional Power Supply 2 - Output Type | Backplanes (gold finger) | Not listed |
| Optional Power Supply 1 - Dimension (WxHxL) | 73.5 x 40 x 265 mm | Not listed |
| Optional Power Supply 2 - Dimension (WxHxL) | 73.5 x 40 x 265 mm | Not listed |
| Environmental / Recycling - Recycle | Not listed | Return Server-End of Life Product |
| Operating Environment - Environmental Spec. | Not listed | Operating Temperature: 10°C to 35°C (50°F to 95°F), Non-operating Temperature: -40°C to 70°C (-40°F to 158°F), Operating Relative Humidity: 8% to 90% (non-conde |
Shaded rows differ. Rows are matched by their label, so two makers' names for the same figure can sit on separate rows; hover a value to see its maker's own label where it differs.