TodayToday's edition
50 specs listed, 39 of them differ. Each value is the maker's own; nothing is converted or scored.
| Field | Supermicro Supermicro SSG-110P-NTR10 | Supermicro Supermicro SSG-522B-ACR12H |
|---|---|---|
| Part number | SSG-110P-NTR10 | SSG-522B-ACR12H |
| Specs, as each maker lists them | ||
| CPU | Single Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors | Single Socket E2 (LGA-4710), Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores |
| Memory | Slot Count: 8 DIMM slots, Max Memory (1DPC): Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM, Supports Intel® Optane™ persistent memory 200 series | Slot Count: 8 DIMM slots/8 Channels, Max Memory (1DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM |
| BIOS Type | AMI 32MB SPI Flash EEPROM | AMI 64MB UEFI |
| Core Count | Up to 40C/80T; Up to 60MB Cache | P-cores: Up to 86C/172T; Up to 336MB Cache | E-cores: Up to 144C/144T; Up to 108MB Cache |
| Motherboard | Super X12SPO-NTF | Super X14SBI-TF |
| Memory Voltage | 1.2V | 1.1V |
| Processor Note | Supports up to 270W TDP CPUs (Air Cooled) | Supports up to 350W TDP CPUs (Air Cooled) |
| Chassis - Model | CSE-116TS-R860CBP-N10 | CSE-826BTS-R1K23LPBP2 |
| Front Panel - LED | Device Activity, LAN 1 Activity, LAN 2 Activity, Power status, System information | Device Activity, LAN 1 Activity, LAN 2 Activity, Power Failure LED, Power status, System information |
| Operating Systems | ESXi 6.7 U3, ESXi 7.0 U2, ESXi 8.0, Hypervisor 8.2, Oracle Linux 8.3, RHEL 8.3, SLES 12 SP5, SLES 15 SP2, SLES 15 SP3, Windows Server 2019, Windows Server 2022 | Oracle Linux 10.2, RHEL 10.0, Windows Server 2022, Windows Server 2025 |
| Security - Features | Cryptographically Signed Firmware, Secure Boot, Secure Firmware Updates, Automatic Firmware Recovery, System Lockdown | Cryptographically Signed Firmware, Secure Boot, Secure Firmware Updates, Automatic Firmware Recovery, System Lockdown, Runtime BMC Protections, Supply Chain Sec |
| Default Power Supply | 2x 860W Redundant (1 + 1) Platinum Level (94%) power supplies | 2x 1200W Redundant (1 + 1) Titanium Level (96%) Hot-plug power supplies |
| Input / Output - DOM | 2 SuperDOM (Disk on Module) portswith built-in power | Not listed |
| Input / Output - LAN | 2 RJ45 1 GbE LAN ports, 1 RJ45 1 GbE Dedicated BMC LAN port (IPMI shared on LAN port 1) | 2 RJ45 10 GbE LAN ports (Intel® X550), 1 RJ45 1 GbE Dedicated BMC LAN port (IPMI shared on LAN port 1) |
| Input / Output - USB | 2 USB 2.0 ports (header), 2 USB 3.2 Gen1 Type-A ports (rear), 2 USB 2.0 Type-A ports (rear), 2 USB 3.2 Gen1 Type-A ports (front), 1 USB 3.2 Gen1 Type-A port | 2 USB 3.2 Gen1 ports (Header), 2 USB 3.2 Gen1 ports (Rear) |
| Chassis - Form Factor | 1U Rackmount | 2U Rackmount |
| Front Panel - Buttons | Power On/Off, UID button | Power On/Off , System Reset |
| Management - Software | SuperCloud Composer® (SCC), Supermicro Server Manager (SSM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), | SuperCloud Composer® (SCC), Supermicro Server Manager (SSM), Super Diagnostics Offline (SDO), Supermicro Thin-Agent Service (TAS), SuperServer Automation Assist |
| System Cooling - Fans | Up to 6 Counter-rotating PWM 40x40x56mm Fan(s) | Up to 3 Heavy Duty PWM 80x80x38mm Fan(s) |
| Input / Output - Video | 1 VGA port | 1 VGA port (Rear) |
| On-Board Devices - BMC | ASPEED AST2600 BMC | Not listed |
| Input / Output - Serial | 1 COM port (Rear), 1 COM port (Header) | 1 COM port (header) |
| On-Board Devices - NVMe | NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required) | NVMe; RAID 0/1 support(Intel® VROC RAID key required) |
| Drive Bays / Storage - M.2 | 2 M.2 PCIe 3.0 x4 NVMe/SATA slots (M-key 2280/22110; VROC required for RAID) | 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 22110(default)) |
| PC Health Monitoring - CPU | 7+1 Phase-switching voltage regulator module (VRM); Monitors for CPU Cores, Chipset Voltages, Memory | 8 Phase-switching voltage regulator; Monitors for CPU Cores, Chipset Voltages, Memory |
| Default Power Supply - +12V | Max: 66.6A / Min: 0A (100Vac-127Vac), Max: 71.6A / Min: 0A (200Vac-240Vac), Max: 71.6A / Min: 0A (200Vdc-240Vdc) | Max: 83A / Min: 0A (100Vac-127Vac), Max: 100A / Min: 0A (200Vac-240Vac), Max: 100A / Min: 0A (200Vdc-240Vdc) |
| Default Power Supply - Input | 800W: 100-127Vac / 50-60Hz, 860W: 200-240Vac / 50-60Hz, 860W: 200-240Vdc / 50-60Hz | 1000W: 100-127Vac / 50-60Hz, 1200W: 200-240Vac / 50-60Hz, 1200W: 200-240Vdc / 50-60Hz (for CCC only) |
| PC Health Monitoring - Temperature | Monitoring for CPU and chassis environment, Thermal Control for fan connectors | CPU thermal trip support, Monitoring for CPU and chassis environment, PECI |
| Chassis Dimensions and Weight - Depth | 23.5" (597 mm) | 25.6" (650 mm) |
| Chassis Dimensions and Weight - Height | 1.7" (43 mm) | 3.5" (89 mm) |
| Chassis Dimensions and Weight - Weight | Gross Weight: 38 lbs (17.24 kg), Net Weight: 25 lbs (11.34 kg) | Gross Weight: 58 lbs (26.3 kg), Net Weight: 34 lbs (15.4 kg) |
| Chassis Dimensions and Weight - Package | 8" (H) x 24" (W) x 32" (D) | 11.5" (H) x 26.5" (W) x 34" (D) |
| Default Power Supply - Dimension (WxHxL) | 54.5 x 40.25 x 322 mm | 76 x 40 x 336 mm |
| Drive Bays / Storage - Drive Bays Configuration | Default: Total 10 bays; 10 front hot-swap 2.5" PCIe 4.0 NVMe drive bays | Default: Total 14 bays; 12 front hot-swap 3.5" NVMe*/SAS/SATA drive bays, 2 rear hot-swap 2.5" NVMe*/SAS/SATA drive bays | (*NVMe support may require additional |
| Expansion Slots - PCI-Express (PCIe) Configuration | Default: 1 PCIe 4.0 x16 FHHL slot | Default: 3 PCIe 5.0 x16 (in x16) LP slots, 3 PCIe 5.0 x8 (in x8) LP slots |
| BIOS Features | Not listed | ACPI 6.5, SMBIOS 3.7 or later, UEFI 2.9 |
| On-Board Devices - SAS | Not listed | SAS (12Gbps) via Broadcom® 3916; RAID 0/1/5/6/10/50/60 support |
| On-Board Devices - SATA | Not listed | 4 x SlimSAS |
| Operating Environment - RoHS | Not listed | RoHS Compliant |
Shaded rows differ. Rows are matched by their label, so two makers' names for the same figure can sit on separate rows; hover a value to see its maker's own label where it differs.