TodayToday's edition
50 specs listed, 36 of them differ. Each value is the maker's own; nothing is converted or scored.
| Field | Supermicro Supermicro SYS-120U-TNR | Supermicro Supermicro SYS-121H-TNR |
|---|---|---|
| Part number | SYS-120U-TNR | SYS-121H-TNR |
| Specs, as each maker lists them | ||
| CPU | Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors | Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM) |
| Memory | Slot Count: 32 DIMM slots, Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM, Supports Intel® Optane™ persistent memory 200 series | Slot Count: 32 DIMM slots, Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM, Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM |
| BIOS Type | AMI 32MB SPI Flash EEPROM | AMI 64MB SPI Flash |
| Core Count | Up to 40C/80T; Up to 60MB Cache per CPU | Up to 64C/128T; Up to 320MB Cache per CPU |
| Motherboard | Super X12DPU-6 | Super X13DEM |
| Max GPU Count | Up to 2 double-width or 2 single-width GPUs | Up to 1 double-width or 3 single-width GPUs |
| Supported GPU | NVIDIA PCIe: A100, A16, A2, L4, T4 | NVIDIA PCIe: H100, L4, L40S, RTX A4000, RTX A5000 |
| Memory Voltage | 1.2V | 1.1V |
| Processor Note | Supports up to 270W TDP CPUs (Air Cooled) | Supports up to 350W TDP CPUs (Air Cooled)*, Supports up to 350W TDP CPUs (Liquid Cooled) , *Air Cooled CPUs with TDP over 250W only supported under specific con |
| Chassis - Model | CSE-119UH3TS-R1K22P-T | CSE-HS119-R1K24P2 |
| Front Panel - LED | HDD activity, LAN1 activity, Power status, System information (overheat/UID) | HDD activity, LAN1 activity, Power, System information |
| Operating Systems | ESXi 6.7 U3, ESXi 7.0 U2, ESXi 8.0, Hypervisor 8.2, Oracle Linux 8.3, RHEL 7.9, RHEL 8.2, RHEL 9.0, SAP HANA 2.0, SLES 12 SP5, SLES 15 SP2, SLES 15 SP3, Windows | ESXi 7.0 U3, ESXi 8.0, Hypervisor 8.2.1, Oracle Linux 9.0, RHEL 8.7, RHEL 9.0, SAP HANA 2.0, SLES 15 SP4, SLES 15 SP5, Windows Server 2022, Windows Server 2025 |
| Security - Features | Cryptographically Signed Firmware, Secure Boot, Secure Firmware Updates, Automatic Firmware Recovery, System Lockdown | Cryptographically Signed Firmware, Secure Boot, Secure Firmware Updates, Automatic Firmware Recovery, Supply Chain Security: Remote Attestation, Runtime BMC Pro |
| Default Power Supply | 1x 1200W Redundant Titanium Level (96%) Hot-plug power supply | 2x 1200W Redundant Titanium Level (96%) Hot-plug power supplies |
| Enterprise Solutions | VMWare vSAN, Microsoft Azure Local, SAP HANA | VMWare vSAN, SAP HCI Solution |
| Input / Output - DOM | 2 SuperDOM (Disk on Module) ports | Not listed |
| Input / Output - USB | 2 USB 3.0 ports (rear), 1 USB 3.0 port (front) | 2 USB 2.0 ports (rear), 1 USB 3.0 port (front) |
| Front Panel - Buttons | Power On/Off, UID button | Power On/Off, Power On/Off , UID button |
| System Cooling - Fans | Up to 8x 4cm heavy duty fans with optimal fan speed control | Up to 8 counter-rotating 40x40x56mm Fan(s) |
| On-Board Devices - NVMe | NVMe; RAID 0/1/5/10 support | NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required) |
| PC Health Monitoring - CPU | 7 +1 Phase-switching voltage regulator; Monitors for CPU Cores, Chipset Voltages, Memory | Monitors for CPU Cores, Chipset Voltages, Memory |
| Default Power Supply - +12V | Max: 66.7A / Min: 0A (100Vac-127Vac), Max: 100A / Min: 0A (200Vac-240Vac), Max: 100A / Min: 0A (200Vdc-240Vdc) | Max: 66.7A / Min: 0A (100Vac-127Vac), Max: 100A / Min: 0A (200Vac-240Vac), Max: 100A / Min: 0A (230Vdc-240Vdc) (for CCC only) |
| Default Power Supply - Input | 800W: 100-127Vac / 50-60Hz, 1200W: 200-240Vac / 50-60Hz, 1200W: 200-240Vdc / 50-60Hz (for CCC only) | 800W: 100-127Vac / 50-60Hz, 1200W: 200-240Vac / 50-60Hz, 1200W: 230-240Vdc / 50-60Hz (for CCC only) |
| Chassis Dimensions and Weight - Depth | 29.1" (739 mm) | 29.4" (747 mm) |
| Chassis Dimensions and Weight - Weight | Gross Weight: 41 lbs (18.6 kg), Net Weight: 26.5 lbs (12.2 kg) | Gross Weight: 49 lbs (22.2 kg), Net Weight: 34 lbs (15.4 kg) |
| Chassis Dimensions and Weight - Package | 7.99" (H) x 23.81" (W) x 37.4" (D) | 8.1" (H) x 23.8" (W) x 40.6" (D) |
| On-Board Devices - Network Connectivity | 2 RJ45 10GBASE-T with Intel® X710-AT2 (optional), 2 RJ45 10GBASE-T with Intel® X710-TM4 (optional), 2 SFP+ 10GbE with Intel® X710-TM4 (optional), No NIC option | Via AIOM |
| Default Power Supply - Dimension (WxHxL) | 73.5 x 40 x 203 mm | 73.5 x 40 x 265 mm |
| Operating Environment - Environmental Spec. | Operating Temperature: 10°C to 35°C (50°F to 95°F), Non-operating Temperature: -40°C to 60°C (-40°F to 140°F), Operating Relative Humidity: 8% to 90% (non-conde | Name: A2 | Operating Temperature: 10°C to 35°C (50°F to 95°F) | Non-operating Temperature: -30°C to 60°C (-40°F to 140°F) | Operating Relative Humidity: 8% to 8 |
| Chassis Dimensions and Weight - Available Color | Black Front & Silver Body | N/A |
| Drive Bays / Storage - Drive Bays Configuration | Default: Total 12 bays; 12 front hot-swap 2.5" NVMe/SAS*/SATA drive bays | (*SAS support may require additional storage controller and/or cables, please see the | Default: Total 8 bays; 8 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays | Option A: Total 12 bays; 12 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays | (*NVMe/ |
| Expansion Slots - PCI-Express (PCIe) Configuration | Default: 1 PCIe 4.0 x16 LP slot, 1 PCIe 4.0 x16 LP slot, 2 PCIe 4.0 x16 FH/10.5"L slots | Default: 1 PCIe 5.0 x16 FHHL slot, 2 PCIe 5.0 x16 FH/10.5"L slots, 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible) |
| Expansion Slots - M.2 | Not listed | 2 M.2 NVMe/SATA slots (B+M-key 2280/22110) |
| Drive Bays / Storage - M.2 | Not listed | 2 M.2 NVMe/SATA slots (M-key 2280/22110) |
| System Cooling - Liquid Cooling | Not listed | Direct to Chip (D2C) Cold Plate (optional) |
| Environmental / Recycling - Recycle | Not listed | Return Server-End of Life Product |
Shaded rows differ. Rows are matched by their label, so two makers' names for the same figure can sit on separate rows; hover a value to see its maker's own label where it differs.