TodayToday's edition
46 specs listed, 28 of them differ. Each value is the maker's own; nothing is converted or scored.
| Field | Supermicro Supermicro SYS-211GT-HNC8R | Supermicro Supermicro SYS-621BT-HNC8R |
|---|---|---|
| Part number | SYS-211GT-HNC8R | SYS-621BT-HNC8R |
| Specs, as each maker lists them | ||
| CPU | Single Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors | Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM) |
| Memory | Slot Count: 16 DIMM slots/2 Channels, Max Memory (2DPC): Up to 4TB 4400MT/s ECC DDR5 RDIMM, Max Memory (2DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM | Slot Count: 16 DIMM slots, Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM |
| Core Count | Up to 64C/128T; Up to 320MB Cache | Up to 64C/128T; Up to 320MB Cache per CPU |
| Motherboard | Super X13SET-GC | Super X13DET-B |
| Processor Note | Supports up to 350W TDP CPUs (Air Cooled)*, *Air Cooled CPUs with TDP over 350W only supported under specific conditions. Contact a Supermicro representative fo | Supports up to 205W TDP CPUs (Air Cooled)*, Supports up to 350W TDP CPUs (Liquid Cooled) , *Air Cooled CPUs with TDP over 125W only supported under specific con |
| Chassis - Model | CSE-GT214BC-R2K21BP | CSE-827BQ2-R3K04P |
| Operating Systems | Oracle Linux 9.0, RHEL 9.0, Windows Server 2022 | ESXi 7.0 U3, ESXi 8.0, Hypervisor 8.2.1, Oracle Linux 9.0, RHEL 9.0, SLES 15 SP4, SLES 15 SP5, Windows Server 2022, Windows Server 2025 |
| Default Power Supply | 1x 2200W Redundant Titanium Level (96%) power supply | 2x 3000W Redundant (1 + 1) Titanium Level (96%) power supplies |
| Enterprise Solutions | Microsoft Azure Local | VMWare vSAN |
| Input / Output - USB | 2 USB 3.0 ports | 2 USB 3.0 Gen2 Type-A ports (Rear) |
| System Cooling - Fans | Up to 2x 16K RPM Heavy Duty 8cm Fan(s) | Up to 4x 14.9K RPM Heavy Duty 8cm Fan(s) |
| Drive Bays / Storage - M.2 | 2 M.2 NVMe/SATA slots (M-key) | 2 M.2 PCIe 4.0 x4 NVMe slots (M-key 22110; VROC required for RAID) |
| Default Power Supply - +12V | Max: 100A / Min: 0A (100Vac-127Vac), Max: 150A / Min: 0A (200Vac-220Vac), Max: 165A / Min: 0A (220Vac-230Vac), Max: 174.17A / Min: 0A (180Vac-220Vac) (For UL/cU | Max: 116A / Min: 0A (100Vac-127Vac), Max: 240A / Min: 0A (200Vac-207Vac), Max: 250A / Min: 0A (208Vac-240Vac), Max: 250A / Min: 0A (240Vdc-240Vdc) (for CQC only |
| Default Power Supply - Input | 1200W: 100-127Vac / 50-60Hz, 1800W: 200-220Vac / 50-60Hz, 1980W: 220-230Vac / 50-60Hz, 2090W: 230-240Vac / 50-60Hz (for TUV/CB), 2090W: 180-220Vac / 50-60Hz (Fo | 1400W: 100-127Vac / 50-60Hz, 2880W: 200-207Vac / 50-60Hz, 3000W: 208-240Vac / 50-60Hz, 3000W: 240-240Vdc / 50-60Hz (for CQC only) |
| Default Power Supply - 12V SB | Max: 2A / Min: 0A | Max: 4.5A / Min: 0A |
| Default Power Supply - Output Type | Backplanes (gold finger) | Backplanes (connector) |
| Chassis Dimensions and Weight - Depth | 28" (711.2 mm) | 30.5" (774 mm) |
| Chassis Dimensions and Weight - Width | 17.67" (449 mm) | 17.68" (449 mm) |
| Chassis Dimensions and Weight - Height | 3.46" (88 mm) | 3.47" (88 mm) |
| Chassis Dimensions and Weight - Weight | Gross Weight: 88 lbs (39.9 kg), Net Weight: 68 lbs (30.8 kg) | Gross Weight: 96.6 lbs (43.8 kg), Net Weight: 66.1 lbs (30 kg) |
| On-Board Devices - Network Connectivity | Via IO Module | Via AIOM |
| Default Power Supply - Dimension (WxHxL) | 106.5 x 84 x 245.3 mm | 45 x 40 x 480 mm |
| Chassis Dimensions and Weight - Available Color | Silver | Black front & silver body |
| Drive Bays / Storage - Drive Bays Configuration | Default: Total 6 bays; 6 front hot-swap 2.5" NVMe/SAS/SATA drive bays | Default: Total 3 bays; 2 front hot-swap 3.5" PCIe 5.0 NVMe/SAS drive bays, 1 front hot-swap 3.5" PCIe 4.0 NVMe/SAS drive bay |
| Expansion Slots - PCI-Express (PCIe) Configuration | Default: 2 PCIe 5.0 x16 AIOM slots (OCP 3.0 compatible) | Default: 2 PCIe 5.0 x16 LP slots, 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible) |
| System Cooling - Air Shroud | Not listed | 4 Air Shrouds |
| System Cooling - Liquid Cooling | Not listed | Direct to Chip (D2C) Cold Plate (optional) |
| Management - Power configurations | Not listed | ACPI/APM Power Management |
Shaded rows differ. Rows are matched by their label, so two makers' names for the same figure can sit on separate rows; hover a value to see its maker's own label where it differs.