TodayToday's edition
49 specs listed, 23 of them differ. Each value is the maker's own; nothing is converted or scored.
| Field | Supermicro Supermicro SYS-220BT-DNTR | Supermicro Supermicro SYS-621BT-DNTR |
|---|---|---|
| Part number | SYS-220BT-DNTR | SYS-621BT-DNTR |
| Specs, as each maker lists them | ||
| CPU | Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors | Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM) |
| Memory | Slot Count: 16 DIMM slots, Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM, Supports Intel® Optane™ persistent memory 200 series | Slot Count: 16 DIMM slots, Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM |
| Core Count | Up to 40C/80T; Up to 60MB Cache per CPU | Up to 64C/128T; Up to 320MB Cache per CPU |
| Motherboard | Super X12DPT-B6 | Super X13DET-B |
| Max GPU Count | Up to 1 double-width or 1 single-width GPU | Not listed |
| Supported GPU | NVIDIA PCIe: A10, T4 | Not listed |
| Memory Voltage | 1.2V | 1.1V |
| Processor Note | Supports up to 270W TDP CPUs (Air Cooled) | Supports up to 350W TDP CPUs (Air Cooled)*, Supports up to 350W TDP CPUs (Liquid Cooled) , *Air Cooled CPUs with TDP over 205W only supported under specific con |
| Chassis - Model | CSE-217BD-000NP | CSE-827BD2-R2K22P |
| Operating Systems | ESXi 6.7 U3, ESXi 7.0 U2, ESXi 8.0, Oracle Linux 8.3, RHEL 7.9, RHEL 8.2, RHEL 9.0, SLES 12 SP5, SLES 15 SP2, SLES 15 SP3, Windows Server 2019, Windows Server 2 | ESXi 7.0 U3, ESXi 8.0, Hypervisor 8.2.1, Oracle Linux 9.0, RHEL 9.0, SLES 15 SP4, SLES 15 SP5, Windows Server 2022 |
| Security - Features | Cryptographically Signed Firmware, Secure Boot, Secure Firmware Updates, Automatic Firmware Recovery, System Lockdown | Cryptographically Signed Firmware, Secure Boot, Secure Firmware Updates, Automatic Firmware Recovery, Supply Chain Security: Remote Attestation, Runtime BMC Pro |
| CPU-GPU Interconnect | PCIe 4.0 x16 CPU-to-GPU Interconnect | Not listed |
| Input / Output - USB | 2 USB 3.0 Type-A ports (Rear) | 2 USB 3.0 Gen2 Type-A ports (Rear) |
| System Cooling - Fans | Up to 4x 16.5K RPM Heavy Duty 8cm Fan(s) | Up to 4x 14.9K RPM Heavy Duty 8cm Fan(s) |
| Drive Bays / Storage - M.2 | 2 M.2 PCIe 3.0 x4 NVMe/SATA slots (M-key 2280(default); VROC required for RAID) | 2 M.2 PCIe 4.0 x4 NVMe slots (M-key 22110(default); VROC required for RAID) |
| PC Health Monitoring - CPU | 7+1 Phase-switching voltage regulator; Monitors for CPU Cores, Chipset Voltages, Memory. | 8+4 Phase-switching voltage regulator; Monitors for CPU Cores, Chipset Voltages, Memory. |
| Chassis Dimensions and Weight - Depth | 28.75" (730 mm) | 30.5" (774 mm) |
| Operating Environment - Environmental Spec. | Operating Temperature: 10°C to 35°C (50°F to 95°F), Non-operating Temperature: -40°C to 60°C (-40°F to 140°F), Operating Relative Humidity: 8% to 90% (Non-Conde | Operating Temperature: 10°C to 35°C (50°F to 95°F), Non-operating Temperature: -30°C to 60°C (-22°F to 140°F), Operating Relative Humidity: 8% to 80% (non-conde |
| Drive Bays / Storage - Drive Bays Configuration | Default: Total 12 bays; 12 front hot-swap 2.5" PCIe 4.0 NVMe/SATA drive bays | Default: Total 6 bays; 2 front hot-swap 3.5" PCIe 5.0 NVMe/SATA drive bays, 4 front hot-swap 3.5" PCIe 4.0 NVMe/SATA drive bays |
| Expansion Slots - PCI-Express (PCIe) Configuration | Default: 2 PCIe 4.0 x8 LP slots, 1 PCIe 4.0 x16 LP slot | Default: 2 PCIe 5.0 x8 LP slots, 1 PCIe 5.0 x16 LP slot, 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible); Option A: 1 PCIe 4.0 x16 FHFL slot, 1 PCIe 5.0 x16 LP sl |
| Expansion Slots - M.2 | Not listed | 2 M.2 NVMe slots (M-key) |
| System Cooling - Liquid Cooling | Not listed | Direct to Chip (D2C) Cold Plate (optional) |
| Environmental / Recycling - Recycle | Not listed | Return Server-End of Life Product |
Shaded rows differ. Rows are matched by their label, so two makers' names for the same figure can sit on separate rows; hover a value to see its maker's own label where it differs.