TodayToday's edition
48 specs listed, 25 of them differ. Each value is the maker's own; nothing is converted or scored.
| Field | Supermicro Supermicro SYS-220BT-HNTR | Supermicro Supermicro SYS-621BT-HNTR |
|---|---|---|
| Part number | SYS-220BT-HNTR | SYS-621BT-HNTR |
| Specs, as each maker lists them | ||
| CPU | Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors | Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM) |
| Memory | Slot Count: 16 DIMM slots, Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM, Supports Intel® Optane™ persistent memory 200 series | Slot Count: 16 DIMM slots, Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM |
| Core Count | Up to 36C/72T; Up to 54MB Cache per CPU | Up to 64C/128T; Up to 320MB Cache per CPU |
| Motherboard | Super X12DPT-B6 | Super X13DET-B |
| Max GPU Count | Up to 2 onboard GPUs | Not listed |
| Supported GPU | NVIDIA PCIe: A2 | Not listed |
| Memory Voltage | 1.2V | 1.1V |
| Processor Note | Supports up to 205W TDP CPUs (Air Cooled) | Supports up to 205W TDP CPUs (Air Cooled)*, Supports up to 350W TDP CPUs (Liquid Cooled) , *Air Cooled CPUs with TDP over 125W only supported under specific con |
| Chassis - Model | CSE-217BQ-000NP | CSE-827BQ2-R3K04P |
| Operating Systems | ESXi 6.7 U3, ESXi 7.0 U2, ESXi 8.0, Oracle Linux 8.3, RHEL 7.9, RHEL 8.2, RHEL 9.0, SAP HANA 2.0, SLES 12 SP5, SLES 15 SP2, SLES 15 SP3, Windows Server 2019, Wi | ESXi 7.0 U3, ESXi 8.0, Hypervisor 8.2.1, Oracle Linux 9.0, RHEL 9.0, SLES 15 SP4, SLES 15 SP5, Windows Server 2022, Windows Server 2025 |
| Security - Features | Cryptographically Signed Firmware, Secure Boot, Secure Firmware Updates, Automatic Firmware Recovery, System Lockdown | Cryptographically Signed Firmware, Secure Boot, Secure Firmware Updates, Automatic Firmware Recovery, Supply Chain Security: Remote Attestation, Runtime BMC Pro |
| CPU-GPU Interconnect | PCIe 4.0 x16 CPU-to-GPU Interconnect | Not listed |
| Default Power Supply | 2x 2600W Redundant (1 + 1) Titanium Level (96%) power supplies | 2x 3000W Redundant (1 + 1) Titanium Level (96%) power supplies |
| Input / Output - USB | 2 USB 3.0 Type-A ports (Rear) | 2 USB 3.0 Gen2 Type-A ports (Rear) |
| System Cooling - Fans | Up to 4x 16.5K RPM Heavy Duty 8cm Fan(s) | Up to 4x 14.9K RPM Heavy Duty 8cm Fan(s) |
| Drive Bays / Storage - M.2 | 2 M.2 PCIe 3.0 x4 NVMe/SATA slots (M-key 2280(default); VROC required for RAID) | 2 M.2 PCIe 4.0 x4 NVMe slots (M-key 22110(default); VROC required for RAID) |
| PC Health Monitoring - CPU | 7+1 Phase-switching voltage regulator; Monitors for CPU Cores, Chipset Voltages, Memory. | 8+4 Phase-switching voltage regulator; Monitors for CPU Cores, Chipset Voltages, Memory. |
| Default Power Supply - +12V | Max: 216.6A, Max: 216.6A / Min: 0A (208Vac-240Vac) | Max: 116A / Min: 0A (100Vac-127Vac), Max: 240A / Min: 0A (200Vac-207Vac), Max: 250A / Min: 0A (208Vac-240Vac), Max: 250A / Min: 0A (240Vdc-240Vdc) (for CQC only |
| Default Power Supply - Input | 2600W: 208-240Vac / 50-60Hz, 2600W: 220-240Vdc / 50-60Hz (for CQC only) | 1400W: 100-127Vac / 50-60Hz, 2880W: 200-207Vac / 50-60Hz, 3000W: 208-240Vac / 50-60Hz, 3000W: 240-240Vdc / 50-60Hz (for CQC only) |
| Chassis Dimensions and Weight - Depth | 28.75" (730 mm) | 30.5" (774 mm) |
| Operating Environment - Environmental Spec. | Operating Temperature: 10°C to 35°C (50°F to 95°F), Non-operating Temperature: -40°C to 60°C (-40°F to 140°F), Operating Relative Humidity: 8% to 90% (Non-Conde | Operating Temperature: 10°C to 35°C (50°F to 95°F), Non-operating Temperature: -30°C to 60°C (-22°F to 140°F), Operating Relative Humidity: 8% to 80% (non-conde |
| Drive Bays / Storage - Drive Bays Configuration | Default: Total 6 bays; 6 front hot-swap 2.5" PCIe 4.0 NVMe/SATA drive bays | Default: Total 3 bays; 2 front hot-swap 3.5" PCIe 5.0 NVMe/SATA drive bays, 1 front hot-swap 3.5" PCIe 4.0 NVMe/SATA drive bay |
| Expansion Slots - PCI-Express (PCIe) Configuration | Default: 2 PCIe 4.0 x16 LP slots | Default: 2 PCIe 5.0 x16 LP slots, 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible) |
| System Cooling - Liquid Cooling | Not listed | Direct to Chip (D2C) Cold Plate (optional) |
| Environmental / Recycling - Recycle | Not listed | Return Server-End of Life Product |
Shaded rows differ. Rows are matched by their label, so two makers' names for the same figure can sit on separate rows; hover a value to see its maker's own label where it differs.