TodayToday's edition
52 specs listed, 18 of them differ. Each value is the maker's own; nothing is converted or scored.
| Field | Supermicro Supermicro SYS-620C-TN12R | Supermicro Supermicro SYS-621C-TN12R |
|---|---|---|
| Part number | SYS-620C-TN12R | SYS-621C-TN12R |
| Specs, as each maker lists them | ||
| CPU | Dual Socket P4 (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors | Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors |
| Memory | Slot Count: 16 DIMM slots, Max Memory (1DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM, Supports Intel® Optane™ persistent memory 200 series | Slot Count: 16 DIMM slots, Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM |
| Core Count | Up to 40C/80T; Up to 60MB Cache per CPU | Up to 64C/128T; Up to 112.5MB Cache per CPU |
| Motherboard | Super X12DDW-A6 | Super X13DDW-A |
| Supported GPU | NVIDIA PCIe: A100, A16, A2, A30, RTX A4500, RTX A5000, RTX A6000; Intel PCIe: Intel Data Center GPU Flex 170 | NVIDIA PCIe: H100, H100 NVL, A2, L4, L40, L40S, NVIDIA RTX PRO™ 4000 Blackwell, NVIDIA RTX PRO™ 4500 Blackwell, NVIDIA RTX PRO™ 6000 Blackwell Max-Q Workstation |
| Memory Voltage | 1.2V | 1.1V |
| Processor Note | Supports up to 270W TDP CPUs (Air Cooled) | Supports up to 350W TDP CPUs (Air Cooled)*, *Air Cooled CPUs with TDP over 270W only supported under specific conditions. Contact a Supermicro representative fo |
| Operating Systems | ESXi 6.7 U3, ESXi 7.0 U2, ESXi 8.0, Hypervisor 8.2, Oracle Linux 8.3, RHEL 8.2, RHEL 9.0, SLES 12 SP5, SLES 15 SP3, SLES 15 SP4, Windows Server 2019, Windows Se | ESXi 7.0 U3, ESXi 8.0, ESXi 9.0, Hypervisor 8.2.1, Oracle Linux 8.10, Oracle Linux 9.0, RHEL 8.7, RHEL 9.0, SAP HANA 2.0, SLES 12 SP5, SLES 15 SP4, Windows Serv |
| Security - Features | Cryptographically Signed Firmware, Secure Boot, Secure Firmware Updates, Automatic Firmware Recovery, System Lockdown | Cryptographically Signed Firmware, Secure Boot, Secure Firmware Updates, Automatic Firmware Recovery, Supply Chain Security: Remote Attestation, Runtime BMC Pro |
| Default Power Supply | 2x 1200W Redundant (1 + 1) Titanium Level (96%) power supplies | 2x 1200W Redundant Titanium Level (96%) Hot-plug power supplies |
| Input / Output - DOM | 1 SuperDOM (Disk on Module) port | Not listed |
| Drive Bays / Storage - M.2 | 2 M.2 PCIe 3.0 x2 NVMe slots (M-key 2280(default); VROC required for RAID) | 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 2280(default); VROC required for RAID) |
| Operating Environment - Environmental Spec. | Operating Temperature: 10°C to 35°C (50°F to 95°F), Non-operating Temperature: -40°C to 60°C (-40°F to 140°F), Operating Relative Humidity: 8% to 90% (Non-Conde | Name: A2 | Operating Temperature: 10°C to 35°C (50°F to 95°F) | Non-operating Temperature: -30°C to 60°C (-40°F to 140°F) | Operating Relative Humidity: 8% to 8 |
| Drive Bays / Storage - Drive Bays Configuration | Default: Total 12 bays; 12 front hot-swap 3.5" NVMe*/SAS*/SATA drive bays | Option A: Total 12 bays; 12 front hot-swap 2.5" NVMe*/SAS*/SATA drive bays | (*NVMe/ | Default: Total 12 bays; 12 front hot-swap 3.5" NVMe*/SAS*/SATA* drive bays | Option A: Total 12 bays; 12 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays | (*NVM |
| Expansion Slots - PCI-Express (PCIe) Configuration | Default: 4 PCIe 4.0 x8 (in x16) FHFL double-width slots, 2 PCIe 4.0 x16 FHHL slots, 2 PCIe 4.0 x16 AIOM slots (OCP 3.0 compatible); Option A: 2 PCIe 4.0 x16 FHF | Default: 4 PCIe 5.0 x8 (in x16) FHFL slots, 2 PCIe 5.0 x16 (in x16) FHHL slots, 2 PCIe 5.0 x16 (in x16) AIOM slots (OCP 3.0 compatible); Option A: 2 PCIe 5.0 x1 |
| Enterprise Solutions | Not listed | VMWare vSAN, SAP HANA |
| On-Board Devices - Chipset | Not listed | Intel® C741 |
| Expansion Slots - CXL Support | Not listed | Up to 2 CXL 1.1 x16/x8 Type 2/Type 3 devices |
Shaded rows differ. Rows are matched by their label, so two makers' names for the same figure can sit on separate rows; hover a value to see its maker's own label where it differs.