Chips · Oct 19, 2026, 10:13
NVIDIA Reportedly Puts All Three HBM Suppliers on TSMC 3nm for NVHBM Base Dies
NVIDIA has reportedly asked Samsung, SK hynix and Micron to build NVHBM base dies on TSMC 3nm, a single logic node for three rival memory makers.
A stacked memory module beside a processor.
Illustration (AI-generated)
Seoul, October 19 — NVIDIA has asked Samsung, SK hynix and Micron to manufacture the base dies for its custom NVHBM memory on TSMC's 3nm process, according to Seoul Economic Daily reporting relayed by Reuters and TrendForce. The request reportedly also standardizes the DRAM core dies on the sixth-generation 1c process.
Samsung's Device Solutions division reportedly accepted after an internal review. None of the five companies has confirmed the arrangement publicly.
The Technical Details
NVHBM, which NVIDIA unveiled in August, moves NVIDIA's own memory controller into the HBM base die. The stated reason for one node is validation: if each supplier builds the logic layer differently, a single controller design behaves differently across vendors.
How NVHBM would be built under the reported request, which is unconfirmed.
VoltGridNews