Chips · Oct 21, 2026, 17:42
Samsung Moves M2800 Modem to 2nm, Frees 4nm Capacity for HBM Base Dies
Samsung's System LSI unit has chosen a 2nm process for its next 5G modem, and The Elec reports the 4nm capacity this frees is being converted to HBM, where 4nm makes the base die.
Samsung's truck for its first commercial HBM4 shipment, from the February announcement; it shows the HBM product, not the modem or foundry lines.
Image: Samsung
Source · Press image from the Samsung newsroom, used for news reporting.
Samsung Electronics will build its next external 5G modem, the M2800, on a 2nm process, and the 4nm capacity that frees is being redirected to HBM production, according to a report by Korean trade publication The Elec on October 20. DigiTimes carried the same development on October 21, saying the freed 4nm capacity will mainly serve HBM base dies.
Moving the M2800 modem to 2nm frees 4nm capacity that The Elec says is being converted to HBM base dies.
Illustration (AI-generated)
The Elec, citing industry sources, said Samsung's System LSI Business made the 2nm decision for the M2800, with development scheduled to finish in 2027. The modem is meant for the Galaxy S28 series, due in 2028, paired with the Exynos 2800. The report adds that the M2700 modem for the Galaxy S27 series stays on 4nm. It said the chip passed favorable internal tests by Samsung's Mobile eXperience business and shrank in area by about 4% through an optical shrink.