BOS, LG and HANA Micron Plan Korean Automotive Chiplets

BOS Semiconductors said on Oct. 20, 2026 that it signed a memorandum of understanding (MOU) on Sept. 30 with LG Electronics, HANA Micron and four other organizations to build automotive chiplets in South Korea.

The Elec dates the same announcement Oct. 21, while BOS's own post and ZDNet Korea carry Oct. 20. BOS, a fabless automotive and physical-AI chip company, said the MOU was signed at the "Future Mobility Ecosystem Cooperation" event hosted by Korea's Ministry of Trade, Industry and Resources, under the ministry's M.AX Alliance (Manufacturing.AX Alliance). It did not name the four other organizations, which it described as specialists in automotive and industrial technologies.

Each named company takes one layer. BOS will develop and supply neural processing unit (NPU) chiplets for autonomous driving and in-vehicle AI computing, and will support interoperability validation, optimization and commercialization. LG Electronics will provide a base chiplet that handles core vehicle system functions. HANA Micron will use its packaging and testing expertise to build multi-chiplet packaging and will provide performance validation and technical support.

For AI-hardware readers the point is the supply chain, not compute. The deal ties a fabless NPU designer, a base-chiplet supplier and a packaging house into one Korean chain that, BOS says, the partners aim to extend from chip design through integration, advanced packaging, testing, validation and real-vehicle trials. Substrates for AI chips are a part the industry is short of: as Voltgrid reported, the Broadcom-TOPPAN joint venture has opened Singapore's first high-end AI substrate plant. This Korean project is aimed at cars, and no source ties it to data-center capacity or power load.

What BOS brings

BOS names two products as the base for its chiplet work: the Eagle-A system-on-chip (SoC), which handles system control and processing, and the Eagle-N high-performance AI accelerator. Its chief technology officer, KM Lim, presented Eagle-N at Hot Chips on Aug. 24, 2026, stressing data movement over raw TOPS (trillions of operations per second). The BOS posts Voltgrid reviewed give no TOPS figure for Eagle-N.

A chiplet design joins separate dies for AI, CPU and input/output through a high-speed interconnect. BOS says this lets one platform scale across vehicle classes and lets developers reuse chiplets across products. The company takes part in the Universal Chiplet Interconnect Express (UCIe) consortium and the Open Chiplet Atlas ecosystem, and said on Oct. 7 that Japan's MIRISE Technologies selected it as a technology partner for an automotive chiplet interconnect research and prototyping project.

The Bosch report came first

The project was reported before the MOU was announced. On Oct. 9, Korean press, first Maeil Business Newspaper and then Wikitree and Kyungbuk Maeil, citing the electronics industry, reported that LG's SoC center was in a ministry-backed chiplet project with BOS and HANA Micron, and that supplying the result to Germany's Bosch was under discussion. Those reports called development early-stage and said neither commercialization nor Bosch supply was settled. DigiTimes headlined its Oct. 14 version as an LG-Bosch team-up. BOS's statement and the Oct. 20 and Oct. 21 reports Voltgrid read do not mention Bosch.

What is not confirmed yet

None of the sources gives a process node, chiplet count, performance figure, funding amount, vehicle customer or production date. BOS has not said which interconnect the three companies' chiplets will use or what the four unnamed organizations will contribute. Bosch is a reported option under discussion, not a customer, and as of Oct. 25 none of the reports Voltgrid reviewed carries a statement from LG, Bosch or HANA Micron on it. Until a prototype schedule or a carmaker is named, this remains a cooperation framework rather than a product.