Hanmi Semiconductor Wins Micron Supplier Award Again, Opens US Unit

Hanmi Semiconductor, the South Korean maker of the thermo-compression (TC) bonders that stack HBM memory, won Micron's Outstanding Supplier Performance Award for a second straight year, the company said on October 22.

The award was presented on October 20, local time, at Micron Supplier Day 2026 at the Boise Centre in Boise, Idaho, according to ZDNet Korea and Newspim. Micron chairman and CEO Sanjay Mehrotra attended. Hanmi was the only South Korean company among the winners; Applied Materials and Lam Research also received the award. Micron gives it each year for quality, technological innovation and collaboration, the reports said.

Why a bonder maker matters to HBM supply

HBM, or high-bandwidth memory, is built by stacking DRAM dies vertically. A TC bonder applies heat and pressure to join those dies, so bonder supply and performance sit directly in the path of HBM output, and HBM output sits in the path of every AI accelerator that uses it. For data-center buyers the bottleneck is rarely one chip; it is the chain of tools and parts behind it. This award shows how closely Micron, one of the three HBM makers, works with a tool vendor it relies on for that step.