NVIDIA Plans 2.5x Substrate Capacity in Three Years, Adds Samsung Electro-Mechanics

NVIDIA said on October 21 at GTC Berlin that it is working with six suppliers to expand manufacturing capacity for substrates, advanced packaging, chip testing and co-packaged optics. In its press release, the company said substrate agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron will together drive a 2.5x increase in substrate capacity over the next three years.

Samsung Electro-Mechanics is joining NVIDIA's substrate supply chain, with immediate capacity from existing operations in South Korea and facility upgrades and new factories planned in Sejong and Busan, NVIDIA said. By 2028, the production allocated to NVIDIA is projected to be a significant portion of the company's total annual package substrate capacity. NVIDIA is providing IBIDEN a multibillion-dollar capacity reservation advance for its Ono Plant in Japan, which targets 3x current capacity, with more ramping from the first quarter of 2028. Unimicron's KF substrate expansion in Taiwan is due to start adding capacity in the second quarter of 2027 and reach full capacity by mid-2028.